24 October 2025

Wavenet has announced a strategic partnership with 8x8 to deliver innovative enterprise communication solutions across Europe.

This collaboration follows Wavenet’s recent recognition as the 8x8 EMEA Resell Partner of the Year 2025 and the 8x8 EMEA Contact Centre Partner of the Year 2025, underscoring their shared commitment to excellence and customer-centric service.

22 October 2025

Goldilock Secure has announced a strategic partnership with Dorado Software, a provider specializing in network deployment, management, and automation solutions.

Under the agreement, Dorado Software will serve as both a reseller and technology partner, enabling Goldilock Secure to enhance its ability to deliver improved control, resilience, and compliance for critical infrastructure and enterprise networks worldwide.

20 October 2025

Mayflex is proud to announce the launch of ReelCycle, a revolutionary returnable reel solution for cut-to-length fibre cables. ReelCycle is designed to deliver more for your business - and the planet.

“At Mayflex, good is never good enough. We’re always looking for ways to do better for our customers and the environment,” says Martin Eccleston, Customer Experience Manager. “ReelCycle is our promise in action: Deliver, Return, Refund, Repeat. It’s about making sustainability simple, practical, and rewarding for everyone.”

07 October 2025

JetCool’s Direct-to-Chip Liquid Cooling offers a cutting-edge solution for modern data centres facing increasing heat loads from AI and high-performance computing (HPC). As CPUs and GPUs grow more powerful, traditional air cooling becomes insufficient, leading to inefficiencies and thermal bottlenecks.

Designed for high power density devices, JetCool’s patented microconvective cooling technology eliminates thermal pastes and interface materials, reducing thermal resistance and boosting performance. This scalable solution can cool devices from 150W up to over 2,000W, making it ideal for next-generation chipsets and demanding workloads. Data centres using JetCool achieve over 80% performance improvements compared to conventional air cooling, while AI applications benefit from stable, efficient operation without costly refrigeration cycles.

07 October 2025

The DCX Standard Server Immersion Enclosure is designed to support standard 19” or 21” servers, allowing for seamless integration within existing data centre infrastructure. It features an immersion depth of 850mm, enabling efficient heat transfer of 61-70 kW depending on configuration. The system offers a power density of approximately 3.6-4 kW per 1RU, supporting up to 20 rack units (RU) or 40 multi-node servers, with the capacity to deliver 2-3 times more compute density per rack compared to traditional cooling methods.

Constructed to fit within the dimensions of a standard 600×1200 mm rack, the enclosure supports single or dual-level configurations for deployment flexibility. It includes a hydraulic compartment with built-in high-capacity heat exchangers and 2N redundant pumps, ensuring continuous operation and reliable heat exchange. The system’s design facilitates easy access to critical components such as pumps and heat exchangers, simplifying maintenance and reducing potential downtime.

07 October 2025

LiquidStack’s two-phase immersion cooling tanks offer highly efficient thermal management solutions designed to maximise data centre performance while minimising space and energy consumption. The tanks are available in a variety of sizes and modular configurations, including the DataTank™ 4U for edge and micro data centres, the DataTank™ 48U for full-scale deployments, as well as prefabricated MicroModular™ and MacroModular™ solutions capable of supporting up to 250kW and 1.5MW respectively. Their scalable design enables deployment across a wide range of applications and facility sizes.

The two-phase immersion technology provides industry-leading cooling capacity, outperforming traditional immersion systems by removing up to 30 times more heat per rack. It achieves significant energy savings, reducing power consumption by approximately 41% compared to air cooling, and lowering CAPEX by 44%. Additionally, it creates space savings of up to 59% in white space, while offering a total cost of ownership (TCO) improvement of around 15% over 20 years. The systems support chips rated up to 1,000W, with advanced flow technology that optimises heat transfer and rejection, enabling as low as 1.02 pPUE.