07 October 2025

JetCool’s Direct-to-Chip Liquid Cooling offers a cutting-edge solution for modern data centres facing increasing heat loads from AI and high-performance computing (HPC). As CPUs and GPUs grow more powerful, traditional air cooling becomes insufficient, leading to inefficiencies and thermal bottlenecks.

Designed for high power density devices, JetCool’s patented microconvective cooling technology eliminates thermal pastes and interface materials, reducing thermal resistance and boosting performance. This scalable solution can cool devices from 150W up to over 2,000W, making it ideal for next-generation chipsets and demanding workloads. Data centres using JetCool achieve over 80% performance improvements compared to conventional air cooling, while AI applications benefit from stable, efficient operation without costly refrigeration cycles.

Beyond performance, JetCool’s cooling modules promote reliability and sustainability — reducing cooling costs by 18%, allowing higher coolant temperatures, and eliminating water consumption. With easy integration and future-proof design, JetCool empowers organisations to operate devices safely and efficiently, supporting growth in AI, HPC, and advanced semiconductor development. Transform thermal management and unlock new levels of compute performance with JetCool’s proven liquid cooling solutions.